What is LED packaging technology?
Date:2011-05-20 12:01
Status:Be resolved
Question:admin
1. extended crystal, the dense arrangement of the chips a little easy to get open solid crystal. 2. solid crystal, the point at the bottom of the bracket conductive / non-conductive adhesive (conductive or not, as the chips are down or left and right type of PN junction PN junction type may be) and then into the bracket inside the chip. 3. a short bake, let the glue cure wire does not move when the chips. 4. wire, gold, silicon and support to turn. 5. before the test, the initial test can not be
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