packaging technology
Date:2011-05-20 11:56
Status:Be resolved
Question:admin
of Im. LED chip and package is no longer the traditional design concepts along the Gong and manufacture production patterns, increasing the chips light output, changes in materials research and development is not limited to the number of impurities, lattice defects and dislocations to improve internal efficiency, while improving the internal structure of the die and package, enhanced LED internally generated photons emitted chance to improve the light efficiency, solve the heat, get light and h
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