Plasma etching of high-brightness LED programme
Date:2011-11-29 17:28
Status:Be resolved
Question:ningcuidi
feasible. A large number of optical delay film wafer etching requirements of each wafer temperature control, which you need to know how to transfer heat from the specimen to a cooling from the plasma electrode. Helium cooling is a key on the back, at the same time to learn how to make each wafer deao efficient cooling to ensure success. The technology of lot sizes from 20*2 up to 43*2 inches to inches, etch rates between 50nm/and 100nm/, the rate depends on the PR and PSS mask shape requirements
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