led display
Date:2011-05-16 11:26
Status:Be resolved
Question:admin
be said to be varied, mainly according to different applications using the corresponding form factor, thermal response and the light effects. Classification according to package LED Lamp-LED, TOP-LED, Side-LED, SMD-LED, High-Power-LED and so on.
3.LED packaging process
4. Packaging technology that
1. Chip testing
Examination: Are there surface pitting of mechanical damage and Ma Hang (lockhill)
Chip size and whether the size of the electrode process requirements
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