led display
Date:2011-05-16 11:26
Status:Be resolved
Question:admin
nding two. Right is the aluminum wire bonding process, the first electrode in the LED chip, the first pressure point, then the aluminum strands to the corresponding bracket above the pressure point on the second aluminum wire snapped. Gold ball bonding process is the first point in the pressure before firing a ball, like the rest of the process.
Bonding is a LED packaging technology in the key link in the main process is the need to monitor the bonding gold (aluminum wire) wire arch shape,
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