LED conductive adhesive
Date:2011-05-16 11:18
Status:Be resolved
Question:admin
First, the production process 1. Process: a) Cleaning: ultrasonic cleaning PCB or LED support, and drying. b) mountings: The LED die (wafer) on the bottom electrode silver paste prepared after the expansion, the expansion of the die after the (wafer) placed in the thorn crystal table, under a microscope with a thorn in the crystal pen die Mounted on a PCB or the LED of a corresponding pad on the support, followed by sintering the silver adhesive curing. c) pressure welding: welding with aluminum
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