LED packaging structure and technology of multiple forms of
Date:2011-06-07 15:08
Status:Be resolved
Question:admin
plete the flip chip bonding of silicon carrier into the heat sink and the shell, the encapsulated wire bond. This package for the light extraction efficiency, thermal performance, and increase the current density are designed to work best.
Its main features: resistance is low, typically only 14 ℃ / W, only the conventional LEDs 1 / 10; reliability, packaging flexibility and stability within the gel filled in the range -40-120 ℃, the temperature will not produced by sudden changes in internal s
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