LED packaging structure and technology of multiple forms of
Date:2011-06-07 15:08
Status:Be resolved
Question:admin
acturers to provide data to 4.0 4.0mm are based on the pad, the pad can be designed using reflow and pin equal.
High brightness LED products can be used PLCC (plastic leaded chip carrier with) -2 package dimensions for the 3.0 2.8mm, high brightness through a unique method of assembly of the die, the product thermal resistance of 400K / W, according to CECC soldered the intensity was issued in the drive current of 50mA 1250mcd. Seven-Segment-style one, two, three and four digital SMD LED displ
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