LED packaging structure and technology of multiple forms of
Date:2011-06-07 15:08
Status:Be resolved
Question:admin
ent up to 70mA, 100mA or 1A level, need to improve the packaging structure, the new LED package design concepts and structure of low thermal resistance package and technology, improved thermal characteristics. For example, the use of large area flip-chip structure, using a good thermal conductivity of silver plastic, metal stents increase the surface area of the silicon carrier solder bump heat sink mounted directly superior method. In addition, application design, PCB circuit board thermal desi
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