High-power LED packaging technology
Date:2010-11-24 16:20
terials (substrate and heat sink thermal structure) internal resistance and interfacial thermal resistance. The role of the substrate is absorbing heat generated by the chips heat and transfer to the heat sink to achieve the heat exchange with the outside world. Commonly used substrate materials including silicon thermal, metal (such as aluminum, copper), ceramic (eg Al2O3, AlN, SiC) and composite materials. Companies such as Nichia LED with the third generation to do CuW substrate, flip chip wi
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