High-power LED packaging technology
Date:2010-11-24 16:20
, high strength, insulation strong, as shown in Figure 2 (b) below. In which aluminum nitride (AlN) the thermal conductivity is 160W/mk, thermal expansion coefficient of 4.0 10-6 / ℃ (coefficient of thermal expansion of silicon 3.2 10-6 / ℃ equivalent), which reduces the package thermal stress.
Figure 2 (a) LTCC metal substrate
Figure 2 (b) Schematic cross-section copper ceramic substrates
The results show that the interface on the thermal resistance of package is also a great, if not cor
11/23 Next Pre Home page Last page
Back
Refresh
WAP Home
Web version
Login
06/26 17:27