High-power LED packaging technology
Date:2010-11-24 16:20
tatic protection circuit, drive circuit and control compensation circuit is not only simple in structure, and because of high thermal conductivity materials, thermal interface less, greatly improving the thermal performance for high-power LED array package proposed solutions. Germany Curmilk company developed high thermal conductivity copper ceramic plate, the ceramic substrate (AlN or Al2O3) and conductive layer (Cu) sintered at high temperature, do not use binders, so good thermal conductivity
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