LED conductive adhesive

First, the production process 1. Process: a) Cleaning: ultrasonic cleaning PCB or LED support, and drying. b) mountings: The LED die (wafer) on the bottom electrode silver paste prepared after the expansion, the expansion of the die after the (wafer) placed in the thorn crystal table, under a microscope with a thorn in the crystal pen die Mounted on a PCB or the LED of a corresponding pad on the support, followed by sintering the silver adhesive curing. c) pressure welding: welding with aluminum wire or gold wire electrodes connected to the LED die on the lead for current injection. LED mounted directly on the PCB, the general use of aluminum wire welding. (TOP-LED need to make white gold wire welder) d) Packaging: By dispensing with epoxy to protect the LED die and wire up. Dispensing in the PCB board, the shape of the cured gel, there are strict requirements, which is directly related to the backlight brightness of the finished product. This process will also assume the point of phosphor (white LED) task. e) Welding: If the backlight is the use of SMD-LED, or other encapsulated LED, in the assembly process, you need to LED soldered to the PCB board. f) cutting film: punch die with all the necessary backlight diffusion film, reflective film. g) Assembly: According to the drawings, a variety of materials to backlight manually install the correct location. h) Test: Check out the backlight optical parameters and light uniformity is good. Packaging: The finished product required packaging, warehousing. Among the most famous Uninwell BQ6886 series.