Thick-film technology make optimized high-power LED

According to the U.S. Department of Energy, Energy Efficiency and Renewable Energy Office to provide information, the success of the design of LED systems cooling is the most important factor. LEDs can be 20% to 30% of electrical energy into visible light, the rest is converted to heat, must be imported from the LED chip circuit board and heat sink. Excess heat will reduce the LED light output and shorten its life. Therefore, the thermal efficiency of the LED upgrade for the best performance potential is very important.

Alternative substrate with heat

Currently, for high power / high brightness of the LED substrate or module use is welded to a metal-based printed circuit board (MCPCB), thermally-enhanced ceramic printed circuit board or substrate, and then received a heat sink substrate adhesion. Although this configuration widely used in the LED industry, but it is not the best cooling method, and manufacturing costs may be high.

MCPCB and thermally enhanced printed circuit board with good cooling performance, but design flexibility is limited, and if the need to improve thermal performance, cost may be high because of the need to spend additional cooling hole processing cost and high cost of thermal insulation materials. Thermal conductivity of the ceramic substrate can be used is not strong but inexpensive ceramic (eg alumina), strong thermal conductivity can also be used but the price is very expensive ceramics (such as aluminum nitride ceramics). All in all, the cost is higher than MCPCB ceramic substrate and a thermally enhanced printed circuit board substrate.

To replace the board, LED manufacturers are testing directly on the aluminum circuit board production, because this method can provide excellent thermal conductivity. Because of its advantages, LED industry are interested in aluminum, but aluminum LED circuit board production needs insulation. Now, the thick-film technology advances the LED industry to get the benefits of using aluminum plates.

Thick thermal paste supplier Heraeus Materials Technology developed by the aluminum plate material system (IAMS) is a low-temperature sintering (below 600 ℃) thick-film insulation system can be printed and sintered in the aluminum plate. IAMS system includes a dielectric material paste, silver conductive paste, glass protective layer and the resistor paste. These materials are suitable for 3000,4000,5000 and 6000 series aluminum plate.