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1.LED chip test
Microscopy: Data for mechanical damage and the appearance of pitting Ma Hang (lockhil chip size and electrode size of the electrode pattern is consistent with process requirements are complete
2.LED expansion film
The distance between LED chips can also be stretched to about 0.6mm by hand expansion, due to LED chips arranged in close dicing pitch and still very small (about 0.1mm after the process is conducive to the operation. By expanding machine to the membrane chip bonding expansion. but it is likely to cause problems and other undesirable waste chips fall.
3.LED Dispensing
Negative electrode with the red, yellow, green chips, LED stent position point corresponding silver plastic or rubber insulation. For GaA SiC conductive substrate. Using silver paste. Insulating sapphire substrates for blue, green LED chips, the use of insulating rubber to fix the chip.
Gel height, location of dispensing process requirements are detailed. Difficulty lies in the amount of process control dispensing.
The wake of silver plastic materials, mixing, time of use are processes must pay attention to. Silver glue and glue the insulation in the storage and use are strict requirements.
Preparation of plastic 4.LED
Preparation of adhesive glue is prepared by first silver plastic coated LED negative electrode, and dispensing the opposite. Then glue the back of the LED devices with silver in the LED bracket. Preparation of adhesive dispensing efficiency is much higher than, but not all products are prepared for plastic process.
5.LED hand thorn pieces
LED fixture on the bottom bracket will be expanded after the LED chip (prepared or not prepared adhesive glue) to settle in the thorn-chip Taiwan fixture. Microscope with a pin to an LED chip, a thorn to the appropriate location. Gill plate and auto-manual than cage has the advantage of easy replacement of different chips at any time, for a variety of chip products need to be installed.
6.LED automatic pallet
LED support on the first point of silver plastic (insulating plastic) and then use the vacuum nozzle to suck from the LED chip mobile location, automatic pallet is a combination of glue stick (glue) and the installation of the chip are two steps. Then placed in the appropriate stent position. Automatically installed on the main frame in process equipment operation should be familiar with programming, while the equipment and installation of precision plastic stick to adjust. Try to use the selection of nozzle bakelite nozzle to prevent the appearance of the LED chip damage, especially blue and green chips required because the steel with bakelite mouth will scratch the surface of the current diffusion layer chip.
7.LED sintering
Required to monitor the sintering temperature, sintering the purpose of curing the silver paste. To prevent the batch of bad. Silver paste sintering temperature is generally controlled at 150 ℃, sintering time 2 hours. Can be adjusted according to actual conditions to 170 ℃, 1 hour. Insulating adhesive generally 150 ℃, 1 hour.
The middle are not free to open. Sintering oven may be other uses, silver plastic sintering oven according to process requirements necessary every 2 hours (or 1 hour) to open the replacement of sintered products. Prevent pollution.
8.LED bonding
Finished products within and outside the lead connections work. The purpose of bonding the electrode lead to the LED chip.
The first LED chip in the first pressure point on the electrode, LED technology has gold ball bonding and welding of two aluminum wire bonding. Right is the aluminum wire bonding process. Aluminum strands and then over to the appropriate support, pressure point on the second aluminum wire snapped. Gold ball bonding process is the first point in the pressure before firing a ball, like the rest of the process.
Need to monitor the process on the main bonding gold (aluminum wire) wire arch shape, bonding is the key LED packaging technology links. Solder joint shape, tension.
9.LED Sealing
With a good selection of epoxy and bracket. General can not leak test LED) LED package mainly a bit plastic, casting, molding of three. Basically, the difficulty is the bubble process control, multi-material shortage, black spots. Designed mainly for material selection.
9.1LED dispensing:
Because the epoxy will thicken during use. White LED phosphor precipitation dispensing there a light chromatic aberration caused the problem. TOP-LED and Side-LED for dispensing package. Manual dispensing package of the operational level requires a very high (especially white LED main difficulty is to dispense the amount of control.
9.2LED filling plastic package
Then insert a good LED bracket bonding, Lamp-LED package in the form of using potting. Casting process is the first in the LED into the liquid epoxy molding cavity. Into the oven for epoxy curing, the LED from the extrusion or molding cavity.
9.3LED molded package
The bottom two mold clamping hydraulic machines and vacuum will be good bonding LED bracket into the mold. Note the solid epoxy adhesive into the heating channel inlet pressure of the hydraulic plunger into the mold runner, epoxy glue along the road into the slot of each LED molding and curing.
10.LED curing and after curing
General epoxy curing conditions 135 ℃, curing refers to curing epoxy package. 1 hour. Molded package is usually in 150 ℃, 4 minutes. After the curing is to allow full curing of epoxy, while LED thermal aging. Post-curing epoxy and support for improving the (PCB bonding strength is very important. The general conditions for the 120 ℃, 4 hours.
11.LED cut tendons and dicing
Need to complete the separation of Dicing work. As LED production is not linked to an individual) Lamp LED package with cut tendons cut stent with LED bars. SMD-LED is a PCB board.
12.LED test
LED according to customer requirements for product separation. LED optical parameters of the test, test dimensions.
13.LED packaging
Count the finished product packaging. Super bright LED need anti-static packaging.
